HiQ® electroplating anodes are manufactured from high purity virgin Tin ingot that removes sludge and reduces melted oxides to minimum, also refined structure of metal grain size. This outstanding production system makes anodes with excellent dissolution and very low defects.
HiQ® electroplating anodes product line covering:

(1) Plating Anode ball(available in various dimension, including full ball, half ball)
    - Half ball Dia.Available:25mm,22mm,20mm,18mm / Dia Tolerance:±3mm
    - Full ball Dia.Available:25mm,15mm / Dia Tolerance:±1mm

(2) Extruded plating anodes(offer a variety of shapes, including Hexagon, Fluted and Stellar with customers’desired length.)

The quality of HiQ® solder bar is guaranteed by using high purity meals and manufacturing under strict quality control in each of process. All solder bars meet or exceed the requirements of QQ--S-571、ASTM B32 and IPC (J-STD-006) standard.

HiQ® solder bar is produced in a propriety process to remove the impurity and natural oxides, which result in lower dross rate and effectively decrease in soldering defects like as non-wetting, bridging and voids. The characteristics of HiQ® lead free solder provide bright solder appearance and excellent solder joint strength.

HiQ® Lead free solder paste are products developed to meet environmental requirements with excellent stability and workability equal to conventional Tin-Lead paste. The slower wetting speeds and high reflow temperature associated with lead-free alloys require enhanced flux activity. HiQ® lead-free solder paste has novel flux systems that are specifically formulated to perform high chemical reliability, good preservation stability, perfect solderability and low generation of solder balls.

HiQ® lead free cored solder wire has been developed for using in the lead-free electronic industry. Its RMA type flux consists of high quality, purified rosin to which has been added an extremely effective activating agent. This promotes effective, fast spreading, good wettingability soldering. The outstanding properties of HiQ® solder wire are significantly improved compared to existing lead free solder technologies and its solderability is comparable to conventional Tin-Lead solder.