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HiQ® Lead Free Solder Paste

on Monday, 01 April 2013. Posted in Product

HiQ® Lead Free Solder Paste

HiQ® Lead free solder paste are products developed to meet environmental requirements with excellent stability and workability equal to conventional Tin-Lead paste. The slower wetting speeds and high reflow temperature associated with lead-free alloys require enhanced flux activity. HiQ® lead-free solder paste has novel flux systems that are specifically formulated to perform high chemical reliability, good preservation stability, perfect solderability and low generation of solder balls.

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